It was listed as a part number from Diodes, Inc. The MPN and
Manufacturer were correct, but the schematic part number was wrong.
Signed-off-by: Sean Cross <sean@xobs.io>
The pad size was sized exactly, which would result in assembly
errors for the TVS diodes. Add some margin to the pad size.
Signed-off-by: Sean Cross <sean@xobs.io>
We only had the bare minimum of copper, which didn't leave a lot of room
for the pick-and-place machine to err. Increase the footprint size for
the TVS diodes.
Signed-off-by: Sean Cross <sean@xobs.io>
The default kicad rules are dumb, and almost caused this PCB to be made
wrongly.
Fix the soldermask so that it actually works at our resolutions.
Signed-off-by: Sean Cross <sean@xobs.io>
Enlarge some pads, to allow the PCB house to stay within tolerances.
They say that pads must be 0.23mm to ensure the laser doesn't escape the
pad.
Signed-off-by: Sean Cross <sean@xobs.io>
Fix up the Fab layer so that it is actually useful now.
Additionally, move the drill origin so that it is in a sane place.
Signed-off-by: Sean Cross <sean@xobs.io>
Modify the `fab` layer so that it defaults to having footprint
identifiers, and places the designators in an area that makes sense.
Signed-off-by: Sean Cross <sean@xobs.io>
Having a full regulator on VCCPLL causes the ESD network in the ICE40 to
freak out, dumping VCCPLL into GND and trying very hard to burn out the
regulator.
Replace it with a simple RC filter network, which is less clean but
results in a happier ESD network.
Signed-off-by: Sean Cross <sean@xobs.io>
Redo the xtal footprint, which was just flat out wrong.
Also, replace the +5V TVS diode with one that can handle more than 5V,
so it's not always shorting out.
Signed-off-by: Sean Cross <sean@xobs.io>
Previously, we would end up shorting power to ground all the time
because the diodes were right on the marginal edge.
Signed-off-by: Sean Cross <sean@xobs.io>
The previous version was very broken. This also redoes some Gerber
files so that maybe they can be opened by the factory?
Signed-off-by: Sean Cross <sean@xobs.io>
This adds a keepout area around the ground plane underneath the IC, to
try and prevent it from migrating during reflow.
Signed-off-by: Sean Cross <sean@xobs.io>
Increase the size of the keepout area in order to remove some extra
copper that was appearing around one of the ground pads.
Signed-off-by: Sean Cross <sean@xobs.io>
