hardware: pcb: add assymetric pads for WLCSP
This incorporates requests made by the PCB vendor. Signed-off-by: Sean Cross <sean@xobs.io>
This commit is contained in:
parent
268b036de8
commit
b271bf309e
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@ -30,7 +30,7 @@
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(35 F.Paste user)
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(36 B.SilkS user)
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(37 F.SilkS user)
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(38 B.Mask user hide)
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(38 B.Mask user)
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(39 F.Mask user)
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(40 Dwgs.User user)
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(41 Cmts.User user)
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@ -87,6 +87,7 @@
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(usegerberattributes false)
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(usegerberadvancedattributes false)
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(creategerberjobfile false)
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(gerberprecision 5)
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(excludeedgelayer true)
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(linewidth 0.100000)
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(plotframeref false)
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@ -183,6 +184,95 @@
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(add_net "Net-(U7-Pad1)")
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)
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(module tomu-fpga:iCE40UP5K-UWG30 (layer B.Cu) (tedit 5C1E5AFA) (tstamp 5BE22E2B)
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(at 24.4 21.9)
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(path /5C122A3A)
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(attr smd)
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(fp_text reference U5 (at 0 -1.5) (layer B.Fab)
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(effects (font (size 0.127 0.127) (thickness 0.03175)) (justify mirror))
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)
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(fp_text value ICE40UP5K-UWG30 (at 0 1.5) (layer B.Fab)
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(effects (font (size 0.1 0.1) (thickness 0.025)) (justify mirror))
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)
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(fp_text user %R (at 0 0) (layer B.Fab)
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(effects (font (size 0.5 0.5) (thickness 0.125)) (justify mirror))
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)
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(fp_line (start -1 -1.2) (end -1 1.15) (layer B.Fab) (width 0.05))
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(fp_line (start 1 -1.2) (end -1 -1.2) (layer B.Fab) (width 0.05))
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(fp_line (start 1 1.15) (end 1 -1.2) (layer B.Fab) (width 0.05))
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(fp_line (start -1 1.15) (end 1 1.15) (layer B.Fab) (width 0.05))
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(fp_circle (center -1.125 1.325) (end -1.075 1.325) (layer B.CrtYd) (width 0.1))
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(fp_line (start 1.1 1.3) (end -1.1 1.3) (layer B.CrtYd) (width 0.05))
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(fp_line (start 1.1 -1.3) (end 1.1 1.3) (layer B.CrtYd) (width 0.05))
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(fp_line (start -1.1 -1.3) (end 1.1 -1.3) (layer B.CrtYd) (width 0.05))
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(fp_line (start -1.1 1.3) (end -1.1 -1.3) (layer B.CrtYd) (width 0.05))
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(pad C3 smd circle (at 0 0.2) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 30 "Net-(U5-PadC3)"))
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(pad B3 smd circle (at 0 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 29 "Net-(U5-PadB3)"))
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(pad A3 smd circle (at 0 1) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 1 GND))
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(pad D3 smd circle (at 0 -0.2) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 9 /CDONE))
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(pad E3 smd circle (at 0 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 28 "Net-(U5-PadE3)"))
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(pad F3 smd circle (at 0 -1) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 8 /CRESET))
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(pad C2 smd circle (at -0.4 0.2) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 17 +1V2))
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(pad B2 smd circle (at -0.4 0.6) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 16 /VCCPLL))
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(pad A2 smd circle (at -0.4 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 10 /ICE_USBN))
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(pad D2 smd circle (at -0.4 -0.2) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 2 +3V3))
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(pad E2 smd circle (at -0.4 -0.6) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 1 GND))
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(pad F2 smd circle (at -0.4 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 6 /SPI_IO2))
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(pad C1 smd circle (at -0.8 0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 4 /SPI_CS))
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(pad B1 smd circle (at -0.8 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 7 /SPI_IO3))
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(pad A1 smd circle (at -0.8 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 11 /ICE_USBP))
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(pad D1 smd circle (at -0.8 -0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 5 /SPI_CLK))
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(pad E1 smd circle (at -0.8 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 3 /SPI_MISO))
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(pad F1 smd circle (at -0.8 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 13 /SPI_MOSI))
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(pad B5 smd circle (at 0.8 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 25 /LED_R))
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(pad A5 smd circle (at 0.8 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 23 /LED_B))
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(pad B4 smd circle (at 0.4 0.6) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 1 GND))
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(pad A4 smd circle (at 0.4 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 15 /PU_CTRL_USBP))
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(pad F5 smd circle (at 0.8 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 19 /TOUCH_4))
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(pad E5 smd circle (at 0.8 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 22 /TOUCH_3))
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(pad E4 smd circle (at 0.4 -0.6) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 20 /TOUCH_1))
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(pad F4 smd circle (at 0.4 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 14 /OSC_IN))
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(pad C4 smd circle (at 0.4 0.2) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 2 +3V3))
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(pad C5 smd circle (at 0.8 0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 24 /LED_G))
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(pad D4 smd circle (at 0.4 -0.2) (size 0.23 0.23) (layers B.Cu B.Paste B.Mask)
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(net 18 +2V5))
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(pad D5 smd circle (at 0.8 -0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 21 /TOUCH_2))
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(model ${KIPRJMOD}/tomu-fpga.pretty/ucBGA-36_2.5x2.5mm_Layout6x6_P0.4mm.step
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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(module tomu-fpga:C_0402_1005Metric (layer B.Cu) (tedit 5B301BBE) (tstamp 5BF8F1F5)
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(at 20.3 25.46 90)
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(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
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@ -688,95 +778,6 @@
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)
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)
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(module tomu-fpga:iCE40UP5K-UWG30 (layer B.Cu) (tedit 5C0F25CB) (tstamp 5BE22E2B)
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(at 24.4 21.9)
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(path /5C122A3A)
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(attr smd)
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(fp_text reference U5 (at 0 -1.5) (layer B.Fab)
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(effects (font (size 0.127 0.127) (thickness 0.03175)) (justify mirror))
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)
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(fp_text value ICE40UP5K-UWG30 (at 0 1.5) (layer B.Fab)
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(effects (font (size 0.1 0.1) (thickness 0.025)) (justify mirror))
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)
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(fp_text user %R (at 0 0) (layer B.Fab)
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(effects (font (size 0.5 0.5) (thickness 0.125)) (justify mirror))
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)
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(fp_line (start -1 -1.2) (end -1 1.15) (layer B.Fab) (width 0.05))
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(fp_line (start 1 -1.2) (end -1 -1.2) (layer B.Fab) (width 0.05))
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(fp_line (start 1 1.15) (end 1 -1.2) (layer B.Fab) (width 0.05))
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(fp_line (start -1 1.15) (end 1 1.15) (layer B.Fab) (width 0.05))
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(fp_circle (center -1.125 1.325) (end -1.075 1.325) (layer B.CrtYd) (width 0.1))
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(fp_line (start 1.1 1.3) (end -1.1 1.3) (layer B.CrtYd) (width 0.05))
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(fp_line (start 1.1 -1.3) (end 1.1 1.3) (layer B.CrtYd) (width 0.05))
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(fp_line (start -1.1 -1.3) (end 1.1 -1.3) (layer B.CrtYd) (width 0.05))
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(fp_line (start -1.1 1.3) (end -1.1 -1.3) (layer B.CrtYd) (width 0.05))
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(pad C3 smd circle (at 0 0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 30 "Net-(U5-PadC3)"))
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(pad B3 smd circle (at 0 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 29 "Net-(U5-PadB3)"))
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(pad A3 smd circle (at 0 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 1 GND))
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(pad D3 smd circle (at 0 -0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 9 /CDONE))
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(pad E3 smd circle (at 0 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 28 "Net-(U5-PadE3)"))
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(pad F3 smd circle (at 0 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 8 /CRESET))
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(pad C2 smd circle (at -0.4 0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 17 +1V2))
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(pad B2 smd circle (at -0.4 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 16 /VCCPLL))
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(pad A2 smd circle (at -0.4 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 10 /ICE_USBN))
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(pad D2 smd circle (at -0.4 -0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 2 +3V3))
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(pad E2 smd circle (at -0.4 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 1 GND))
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(pad F2 smd circle (at -0.4 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 6 /SPI_IO2))
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(pad C1 smd circle (at -0.8 0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 4 /SPI_CS))
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(pad B1 smd circle (at -0.8 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 7 /SPI_IO3))
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(pad A1 smd circle (at -0.8 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 11 /ICE_USBP))
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(pad D1 smd circle (at -0.8 -0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 5 /SPI_CLK))
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(pad E1 smd circle (at -0.8 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 3 /SPI_MISO))
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(pad F1 smd circle (at -0.8 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 13 /SPI_MOSI))
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(pad B5 smd circle (at 0.8 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 25 /LED_R))
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(pad A5 smd circle (at 0.8 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 23 /LED_B))
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(pad B4 smd circle (at 0.4 0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 1 GND))
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(pad A4 smd circle (at 0.4 1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 15 /PU_CTRL_USBP))
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(pad F5 smd circle (at 0.8 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 19 /TOUCH_4))
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(pad E5 smd circle (at 0.8 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 22 /TOUCH_3))
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(pad E4 smd circle (at 0.4 -0.6) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 20 /TOUCH_1))
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(pad F4 smd circle (at 0.4 -1) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 14 /OSC_IN))
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(pad C4 smd circle (at 0.4 0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 2 +3V3))
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(pad C5 smd circle (at 0.8 0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 24 /LED_G))
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(pad D4 smd circle (at 0.4 -0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 18 +2V5))
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(pad D5 smd circle (at 0.8 -0.2) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
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(net 21 /TOUCH_2))
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(model ${KIPRJMOD}/tomu-fpga.pretty/ucBGA-36_2.5x2.5mm_Layout6x6_P0.4mm.step
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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(module tomu-fpga:C_0201_0603Metric (layer B.Cu) (tedit 5C0F2477) (tstamp 5C0F2497)
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(at 25.5 24.2)
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(descr "Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
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@ -3148,7 +3149,7 @@
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(segment (start 22.95 17.85) (end 22.725 18.075) (width 0.4) (layer B.Cu) (net 31) (status 30))
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(segment (start 22.775 17.95) (end 22.725 18) (width 0.4) (layer B.Cu) (net 31) (status 30))
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(zone (net 19) (net_name /TOUCH_4) (layer B.Cu) (tstamp 5C0F74A8) (hatch edge 0.508)
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(zone (net 19) (net_name /TOUCH_4) (layer B.Cu) (tstamp 5C1E777B) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0))
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(min_thickness 0.254)
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@ -3174,7 +3175,7 @@
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)
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)
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)
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(zone (net 19) (net_name /TOUCH_4) (layer F.Cu) (tstamp 5C0F74A5) (hatch edge 0.508)
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(zone (net 19) (net_name /TOUCH_4) (layer F.Cu) (tstamp 5C1E7778) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0))
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(min_thickness 0.254)
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@ -3200,7 +3201,7 @@
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)
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)
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)
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(zone (net 22) (net_name /TOUCH_3) (layer F.Cu) (tstamp 5C0F74A2) (hatch edge 0.508)
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(zone (net 22) (net_name /TOUCH_3) (layer F.Cu) (tstamp 5C1E7775) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0))
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(min_thickness 0.254)
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@ -3228,7 +3229,7 @@
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)
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)
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)
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(zone (net 20) (net_name /TOUCH_1) (layer F.Cu) (tstamp 5C0F749F) (hatch edge 0.508)
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(zone (net 20) (net_name /TOUCH_1) (layer F.Cu) (tstamp 5C1E7772) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0))
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(min_thickness 0.254)
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@ -3258,7 +3259,7 @@
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)
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)
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)
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(zone (net 21) (net_name /TOUCH_2) (layer F.Cu) (tstamp 5C0F749C) (hatch edge 0.508)
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(zone (net 21) (net_name /TOUCH_2) (layer F.Cu) (tstamp 5C1E776F) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0))
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(min_thickness 0.254)
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@ -3286,7 +3287,7 @@
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)
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)
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)
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(zone (net 21) (net_name /TOUCH_2) (layer B.Cu) (tstamp 5C0F7499) (hatch edge 0.508)
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(zone (net 21) (net_name /TOUCH_2) (layer B.Cu) (tstamp 5C1E776C) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0))
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(min_thickness 0.254)
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@ -3314,7 +3315,7 @@
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)
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)
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)
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(zone (net 20) (net_name /TOUCH_1) (layer B.Cu) (tstamp 5C0F7496) (hatch edge 0.508)
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(zone (net 20) (net_name /TOUCH_1) (layer B.Cu) (tstamp 5C1E7769) (hatch edge 0.508)
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(priority 2)
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(connect_pads yes (clearance 0))
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(min_thickness 0.254)
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@ -3343,7 +3344,7 @@
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)
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)
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)
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(zone (net 12) (net_name +5V) (layer B.Cu) (tstamp 5C0F7493) (hatch edge 0.508)
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(zone (net 12) (net_name +5V) (layer B.Cu) (tstamp 5C1E7766) (hatch edge 0.508)
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(priority 1)
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(connect_pads yes (clearance 0))
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(min_thickness 0.1)
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|
@ -3406,7 +3407,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5C0F7490) (hatch edge 0.508)
|
||||
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5C1E7763) (hatch edge 0.508)
|
||||
(connect_pads yes (clearance 0.1))
|
||||
(min_thickness 0.254)
|
||||
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
|
|
@ -3540,7 +3541,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 2) (net_name +3V3) (layer In2.Cu) (tstamp 5C0F748D) (hatch edge 0.508)
|
||||
(zone (net 2) (net_name +3V3) (layer In2.Cu) (tstamp 5C1E7760) (hatch edge 0.508)
|
||||
(priority 5)
|
||||
(connect_pads yes (clearance 0.1))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3557,7 +3558,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 2) (net_name +3V3) (layer In1.Cu) (tstamp 5C0F748A) (hatch edge 0.508)
|
||||
(zone (net 2) (net_name +3V3) (layer In1.Cu) (tstamp 5C1E775D) (hatch edge 0.508)
|
||||
(priority 1)
|
||||
(connect_pads yes (clearance 0.1))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3633,7 +3634,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 17) (net_name +1V2) (layer In2.Cu) (tstamp 5C0F7487) (hatch edge 0.508)
|
||||
(zone (net 17) (net_name +1V2) (layer In2.Cu) (tstamp 5C1E775A) (hatch edge 0.508)
|
||||
(priority 5)
|
||||
(connect_pads yes (clearance 0.1))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3658,7 +3659,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 18) (net_name +2V5) (layer In1.Cu) (tstamp 5C0F7484) (hatch edge 0.508)
|
||||
(zone (net 18) (net_name +2V5) (layer In1.Cu) (tstamp 5C1E7757) (hatch edge 0.508)
|
||||
(priority 6)
|
||||
(connect_pads yes (clearance 0.1))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3681,7 +3682,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 22) (net_name /TOUCH_3) (layer B.Cu) (tstamp 5C0F7481) (hatch edge 0.508)
|
||||
(zone (net 22) (net_name /TOUCH_3) (layer B.Cu) (tstamp 5C1E7754) (hatch edge 0.508)
|
||||
(priority 2)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3708,7 +3709,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 17) (net_name +1V2) (layer In1.Cu) (tstamp 5C0F747E) (hatch edge 0.508)
|
||||
(zone (net 17) (net_name +1V2) (layer In1.Cu) (tstamp 5C1E7751) (hatch edge 0.508)
|
||||
(priority 2)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3729,7 +3730,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 1) (net_name GND) (layer In1.Cu) (tstamp 5C0F747B) (hatch edge 0.508)
|
||||
(zone (net 1) (net_name GND) (layer In1.Cu) (tstamp 5C1E774E) (hatch edge 0.508)
|
||||
(priority 4)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3757,7 +3758,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 2) (net_name +3V3) (layer In2.Cu) (tstamp 5C0F7478) (hatch edge 0.508)
|
||||
(zone (net 2) (net_name +3V3) (layer In2.Cu) (tstamp 5C1E774B) (hatch edge 0.508)
|
||||
(priority 2)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3777,7 +3778,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 12) (net_name +5V) (layer In1.Cu) (tstamp 5C0F7475) (hatch edge 0.508)
|
||||
(zone (net 12) (net_name +5V) (layer In1.Cu) (tstamp 5C1E7748) (hatch edge 0.508)
|
||||
(priority 2)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3794,7 +3795,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 12) (net_name +5V) (layer In2.Cu) (tstamp 5C0F7472) (hatch edge 0.508)
|
||||
(zone (net 12) (net_name +5V) (layer In2.Cu) (tstamp 5C1E7745) (hatch edge 0.508)
|
||||
(priority 2)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3819,7 +3820,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 17) (net_name +1V2) (layer In2.Cu) (tstamp 5C0F746F) (hatch edge 0.508)
|
||||
(zone (net 17) (net_name +1V2) (layer In2.Cu) (tstamp 5C1E7742) (hatch edge 0.508)
|
||||
(priority 2)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3836,7 +3837,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 16) (net_name /VCCPLL) (layer In1.Cu) (tstamp 5C0F746C) (hatch edge 0.508)
|
||||
(zone (net 16) (net_name /VCCPLL) (layer In1.Cu) (tstamp 5C1E773F) (hatch edge 0.508)
|
||||
(priority 6)
|
||||
(connect_pads yes (clearance 0.1))
|
||||
(min_thickness 0.254)
|
||||
|
|
@ -3857,7 +3858,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5C0F7469) (hatch edge 0.508)
|
||||
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5C1E773C) (hatch edge 0.508)
|
||||
(connect_pads yes (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
||||
|
|
@ -4019,7 +4020,7 @@
|
|||
)
|
||||
)
|
||||
)
|
||||
(zone (net 2) (net_name +3V3) (layer In2.Cu) (tstamp 5C0F7466) (hatch edge 0.508)
|
||||
(zone (net 2) (net_name +3V3) (layer In2.Cu) (tstamp 5C1E7739) (hatch edge 0.508)
|
||||
(priority 1)
|
||||
(connect_pads (clearance 0.1))
|
||||
(min_thickness 0.254)
|
||||
|
|
|
|||
Loading…
Reference in New Issue