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hardware: pcb: increase under-fpga keepout area size

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Increase the size of the keepout area in order to remove some extra
copper that was appearing around one of the ground pads.

Signed-off-by: Sean Cross <sean@xobs.io>
This commit is contained in:
Sean Cross 2018-11-18 15:51:40 +08:00
parent 4da7854799
commit 1af0d1c06e
1 changed files with 118 additions and 125 deletions
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243
hardware/pcb/tomu-fpga.kicad_pcb
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(zone (net 2) (net_name +3V3) (layer In2.Cu) (tstamp 5BF11A1B) (hatch edge 0.508)
(priority 1)
(connect_pads (clearance 0.1))
(min_thickness 0.254)
@ -4094,7 +4087,7 @@
(fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(xy 25.2 22.825) (xy 25.2 21.025) (xy 23.5 21.025) (xy 23.5 22.825)
(xy 25.225 23.075) (xy 25.2 21.025) (xy 23.5 21.025) (xy 23.525 23.075)
)
)
)