e535c2fa15
hardware: footprint: add footprint for 11V TVS diode
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-20 23:39:48 +08:00
6ccdc4e386
hardware: footprints: fix XTAL footprint
...
The previous footprint was super super broken.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-20 22:56:38 +08:00
fcbb4420d3
hardware: pcb: re-tune differential pair
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-18 15:56:29 +08:00
1af0d1c06e
hardware: pcb: increase under-fpga keepout area size
...
Increase the size of the keepout area in order to remove some extra
copper that was appearing around one of the ground pads.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-18 15:51:40 +08:00
a3621766c5
hardware: cache: commit kicad's line-ending changes
...
I really don't know why it keeps doing this...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-18 14:47:27 +08:00
5d90502947
pcb: fix up assembly notes layers
...
Resize the assembly note layers so that it's usable (in theory).
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-18 14:46:44 +08:00
7a4497b0c9
hardware: pcb: connect usb esd diodes inline first
...
Move the USB ESD diodes so they connect first.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-17 17:58:54 +08:00
3e72bd1086
hardware: sch: add column for "DNP"
...
After discussing with one factory, this is their preferred method of
indicating a part is "Do-Not-Populate".
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-17 15:19:17 +08:00
28aae5e4a8
hardware: footprints: 8-uson: redo footprint from pdf
...
Redo the footprint for the SPI flash chip from a recommended footprint
provided by one of the vendors.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-17 15:18:25 +08:00
64020199e8
hardware: cache: commit kicad's line-ending change
...
Why does it do this? No one can say.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 21:45:25 +08:00
5a074ea4e1
hardware: pcb: finish routing with esd diodes
...
Finish routing the PCB with the esd diodes in place.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 21:44:49 +08:00
6344d45c1b
hardware: sch: define spi part numbers for dvt board
...
This part is smaller. Define both the part number and an alternative
part number.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 21:44:12 +08:00
8b7adafd9d
hardware: pcb: finish first draft of esd routing
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 16:44:52 +08:00
f7cd16496c
hardware: footprint: add footprint for esd diode
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 16:44:17 +08:00
dcc33ac81b
hardware: pcb: partial routing of new esd diodes
...
There's still a bit more to go...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 12:49:25 +08:00
9ec87cb483
hardware: sch: add esd diodes
...
These will be placed on the USB lines as well as the captouch lines.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 12:49:05 +08:00
d0bd902112
hardware: lib: update cache file
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 12:48:37 +08:00
9abd177b38
hardware: sch: remove "-rescue" and "-tomu-fpga"
...
Somehow, KiCad added these strings to the parts libraries, which
resulted in referencing a file that didn't exist.
Remove them.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-16 10:25:05 +08:00
cc19668309
hardware: pcb: reduce the number of capacitors
...
This is an initial commit removing the excess capacitors.
We will eventually add ESD protection ICs in the space that has been
freed up.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-15 19:24:55 +08:00
a98cd5727e
hardware: sch: remove excess decoupling caps
...
We probably don't need 10nF, because this won't do any very-high-speed
(>100 MHz) operations. We can think about putting them back in later,
space permitting.
Additionally, remove an extra bank of caps for one of the IO pads.
We'll double-up on capacitors there, which should be alright given the
close proximity and the fact that the only thing on that IO bank is
captouch.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-15 19:23:05 +08:00
23106ab57d
hardware: pcb: reduce ground fill, loosen up routing
...
Reduce the ground fill under the IC, to prevent it from sliding around.
This gives less copper, but it should be fine for the currents we're
drawing.
Loosen up the routing of the 5V plane, which involves moving some
components around. This increases the amount of copper that goes to the
various regulators.
Finally, reorder the caps so that the larger ones are further from the
IC. This is done because they have a slower response time, and so can
be further away.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-15 19:14:24 +08:00
22aa8c8aca
hardware: pcb: hide usb footprint silk
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-15 14:49:14 +08:00
b151d005f2
hardware: pcb: update PCB to use local copies of 3D files
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-15 14:46:54 +08:00
06be1fdb35
hardware: footprint: add models for regulator, BGA
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-15 14:46:23 +08:00
571646f5c1
hardware: pcb: more tuning of traces and pours
...
Open up some more pours, and move some vias to make pours larger.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-09 18:21:39 +08:00
bdf8b8558d
hardware: pcb: remove text leftover from EFM32
...
This was used to select which ARM MCU to use. It is no longer relevant.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-09 16:45:06 +08:00
77d47db980
hardware: sch: add some spice models to passives
...
Identify passives and implement the various spice models.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-08 21:43:32 +08:00
294ecfe782
hardware: pcb: add more copper to 1.2V line
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-08 19:11:24 +08:00
8050e796ab
hardware: pcb: clean up traces, widen up pours
...
Rework the traces somewhat to widen up the pours and remove some of the
bifurcation that's going on.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-08 19:07:56 +08:00
c2566ea16d
hardware: pcb: add version and update silkscreen
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-07 21:47:16 +08:00
e87a882f84
hardware: footprints: add local copies of 3D models
...
Because these files keep moving, add local copies of all of these files.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-07 21:39:38 +08:00
66584765ff
hardware: footprints: add new SON50
...
This has more copper, which might make hand-soldering easier. Though
this PCB isn't going to be hand-soldered.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-07 21:21:21 +08:00
db938e5557
hardware: pcb: first full routing of pcb
...
This passes DRC and has no unconnected nets.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-07 21:20:53 +08:00
d2b73fbc5e
hardware: schematic: rewire fpga as necessary for routing
...
FPGAs are great, because if there's an alternate method that's easier to
route -- go for it! This modifies some of the connections to ease
routing constraints.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-07 21:20:05 +08:00
cdcbe4dece
hardware: footprints: add new footprints
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-06 19:45:14 +08:00
140717e3c6
hardware: pcb: first unrouted layout of dvt1
...
This is just a placement test, to see if it can be laid out.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-06 19:44:12 +08:00
596c686249
hardware: sch: complete schematic layout of DVT1
...
This is the first cut of a schematic layout of DVT1.
It includes all the decoupling caps still. We'll need to see if they're
kept around.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-06 19:43:31 +08:00
a6fa6cf3e9
hardware: footprints: cleanup ice40 footprints
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-06 19:42:01 +08:00
bbc18d2a90
hardware: sch: work-in-progress to go from QFN to WLCSP
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-05 13:03:36 +08:00
f9205b7027
hardware: pcb: replace pcb with usb-tomu version
...
We'll use this as a starting point, to maintain the same shape and size.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-05 13:03:07 +08:00
d518357f76
hardware: footprints: add testpoint footprint
...
This is from Tomu, so it's verified to be the correct size.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-05 13:02:28 +08:00
75c15fdb98
hardware: footprints: initial commit of WLCSP models
...
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-05 08:45:58 +08:00
34f74fbf51
hardware: sch: first draft of dvt1
...
This removes much of the support debugging stuff from evt1. Still to
do:
- Assign footprints
- Figure out which PU resistor to include (if any)
- Figure out if we need to keep the USB buffering
- Remove extra decoupling caps
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-04 22:00:23 +08:00
0bda71a0c8
hardware: footprints: add power regulator footprint
...
Add a footprint from KiCad for the power regulator we'll use.
It refers to a 3D file that doesn't exist, so we'll need to find that
first.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-04 21:57:55 +08:00
49d2924c26
hardware: pcb: redo timestamps, because kicad
...
kicad decided to redo all the timestamps. There are no other changes to
this commit.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-03 11:50:44 +08:00
25b662e6fb
hardware: pcb: re-route USB after flipping the footprint
...
It looks kinda janky, but it's better than ripping everything up and
starting over.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-02 20:39:32 +08:00
87ab2799bf
hardawre: footprints: reverse USB footprints
...
They were copied incorrectly. Fix the footprints so the pads are no
longer mirrored.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-02 20:38:56 +08:00
da8ede5f75
hardware: fix USB footprint being mirrored
...
That could have been bad.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-02 20:38:34 +08:00
8bb0524872
hardware: sch: provide APN for RGB LED
...
Provide an alternate part number for the RGB LED, since the current one
is hard to source.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-02 19:48:25 +08:00
6214f995e9
hardware: pcb: increase USB connector size
...
It was only 11.3mm before. Make it 11.7mm, and center it.
Signed-off-by: Sean Cross <sean@xobs.io>
2018-11-02 19:48:25 +08:00
