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hardawre: footprints: reverse USB footprints 

They were copied incorrectly.  Fix the footprints so the pads are no
longer mirrored.

Signed-off-by: Sean Cross <sean@xobs.io>
This commit is contained in:
Sean Cross 2018-11-02 20:38:56 +08:00
parent da8ede5f75
commit 87ab2799bf
1 changed files with 10 additions and 10 deletions
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20
hardware/pcb/tomu-fpga.pretty/USB-B.kicad_mod
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@ -1,8 +1,8 @@
(module USB-B (layer F.Cu) (tedit 5BDAAD31)
(module USB-B (layer F.Cu) (tedit 5BDC3E7B)
(solder_mask_margin 0.000001)
(solder_paste_margin 0.000001)
(clearance 0.000001)
(fp_text reference U9 (at 4.6 -4.7 180) (layer F.SilkS)
(fp_text reference U9 (at 3 2) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value USB-B (at -2 2) (layer F.Fab)
@ -12,20 +12,20 @@
(fp_line (start 5.8 -3.8) (end -5.8 -3.8) (layer F.CrtYd) (width 0.3))
(fp_line (start 5.8 8) (end 5.8 -3.8) (layer F.CrtYd) (width 0.3))
(fp_line (start -5.8 8) (end 5.8 8) (layer F.CrtYd) (width 0.3))
(pad 1 smd rect (at -3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask)
(pad 4 smd rect (at -3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001))
(pad 4 smd rect (at 3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask)
(pad 1 smd rect (at 3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001))
(pad 3 smd rect (at 1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask)
(pad 2 smd rect (at 1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001))
(pad 2 smd rect (at -1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask)
(pad 3 smd rect (at -1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001))
(pad 1 smd trapezoid (at -3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask)
(pad 4 smd trapezoid (at -3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001))
(pad 1 smd rect (at -2.81 6.7 180) (size 1.375 1.3) (layers F.Cu F.Mask)
(pad 4 smd rect (at -2.81 6.699999 180) (size 1.375 1.3) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001))
(pad 4 smd rect (at 2.8 6.7 180) (size 1.375 1.3) (layers F.Cu F.Mask)
(pad 1 smd rect (at 2.8 6.699999 180) (size 1.375 1.3) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001))
(pad 4 smd trapezoid (at 3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask)
(pad 1 smd trapezoid (at 3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask)
(solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001))
)