Change the output directory to `dvt2a`.
Also, KiCad really likes to redo timestamps. So everything in this file
has had its timestamp updated, and nothing else.
Signed-off-by: Sean Cross <sean@xobs.io>
Add the initial documents such as gerbers and netlist files.
This is still missing the assembly diagrams as well as the BOM.
Signed-off-by: Sean Cross <sean@xobs.io>
Route pin A5 to 3.3V instead of GND. As part of the schematic change,
two capacitors needed to be rotated, though this shouldn't affect
anything electrically.
Also update the pinout for the RGB LED, but don't change the gerber
traces at all.
Practically, the only change is on layer 3 where a 3.3V pour has been
extended so that it is hit by pin A5.
Signed-off-by: Sean Cross <sean@xobs.io>
These pins were incorrectly swapped. In practice, this wasn't an issue,
because pin 4 is the key and that was correct. We just had incorrect
color mappings.
Signed-off-by: Sean Cross <sean@xobs.io>
Replace the previous silk "pad" with an actual circle. Many tools don't
cope well with pads on the silk layer.
Signed-off-by: Sean Cross <sean@xobs.io>
It was listed as a part number from Diodes, Inc. The MPN and
Manufacturer were correct, but the schematic part number was wrong.
Signed-off-by: Sean Cross <sean@xobs.io>
The pad size was sized exactly, which would result in assembly
errors for the TVS diodes. Add some margin to the pad size.
Signed-off-by: Sean Cross <sean@xobs.io>
We only had the bare minimum of copper, which didn't leave a lot of room
for the pick-and-place machine to err. Increase the footprint size for
the TVS diodes.
Signed-off-by: Sean Cross <sean@xobs.io>
The default kicad rules are dumb, and almost caused this PCB to be made
wrongly.
Fix the soldermask so that it actually works at our resolutions.
Signed-off-by: Sean Cross <sean@xobs.io>
Enlarge some pads, to allow the PCB house to stay within tolerances.
They say that pads must be 0.23mm to ensure the laser doesn't escape the
pad.
Signed-off-by: Sean Cross <sean@xobs.io>
Fix up the Fab layer so that it is actually useful now.
Additionally, move the drill origin so that it is in a sane place.
Signed-off-by: Sean Cross <sean@xobs.io>
Modify the `fab` layer so that it defaults to having footprint
identifiers, and places the designators in an area that makes sense.
Signed-off-by: Sean Cross <sean@xobs.io>
Having a full regulator on VCCPLL causes the ESD network in the ICE40 to
freak out, dumping VCCPLL into GND and trying very hard to burn out the
regulator.
Replace it with a simple RC filter network, which is less clean but
results in a happier ESD network.
Signed-off-by: Sean Cross <sean@xobs.io>
Redo the xtal footprint, which was just flat out wrong.
Also, replace the +5V TVS diode with one that can handle more than 5V,
so it's not always shorting out.
Signed-off-by: Sean Cross <sean@xobs.io>
Previously, we would end up shorting power to ground all the time
because the diodes were right on the marginal edge.
Signed-off-by: Sean Cross <sean@xobs.io>
The previous version was very broken. This also redoes some Gerber
files so that maybe they can be opened by the factory?
Signed-off-by: Sean Cross <sean@xobs.io>
This adds a keepout area around the ground plane underneath the IC, to
try and prevent it from migrating during reflow.
Signed-off-by: Sean Cross <sean@xobs.io>
Increase the size of the keepout area in order to remove some extra
copper that was appearing around one of the ground pads.
Signed-off-by: Sean Cross <sean@xobs.io>
