From 87ab2799bfac50184bc9a744d1d71752d80812d7 Mon Sep 17 00:00:00 2001 From: Sean Cross Date: Fri, 2 Nov 2018 20:38:56 +0800 Subject: [PATCH] hardawre: footprints: reverse USB footprints They were copied incorrectly. Fix the footprints so the pads are no longer mirrored. Signed-off-by: Sean Cross --- hardware/pcb/tomu-fpga.pretty/USB-B.kicad_mod | 20 +++++++++---------- 1 file changed, 10 insertions(+), 10 deletions(-) diff --git a/hardware/pcb/tomu-fpga.pretty/USB-B.kicad_mod b/hardware/pcb/tomu-fpga.pretty/USB-B.kicad_mod index b7d144a..0913cf4 100644 --- a/hardware/pcb/tomu-fpga.pretty/USB-B.kicad_mod +++ b/hardware/pcb/tomu-fpga.pretty/USB-B.kicad_mod @@ -1,8 +1,8 @@ -(module USB-B (layer F.Cu) (tedit 5BDAAD31) +(module USB-B (layer F.Cu) (tedit 5BDC3E7B) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) - (fp_text reference U9 (at 4.6 -4.7 180) (layer F.SilkS) + (fp_text reference U9 (at 3 2) (layer F.SilkS) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text value USB-B (at -2 2) (layer F.Fab) @@ -12,20 +12,20 @@ (fp_line (start 5.8 -3.8) (end -5.8 -3.8) (layer F.CrtYd) (width 0.3)) (fp_line (start 5.8 8) (end 5.8 -3.8) (layer F.CrtYd) (width 0.3)) (fp_line (start -5.8 8) (end 5.8 8) (layer F.CrtYd) (width 0.3)) - (pad 1 smd rect (at -3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask) + (pad 4 smd rect (at -3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001)) - (pad 4 smd rect (at 3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask) + (pad 1 smd rect (at 3.5 1.3 180) (size 2.75 9.5) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001)) - (pad 3 smd rect (at 1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask) + (pad 2 smd rect (at 1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001)) - (pad 2 smd rect (at -1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask) + (pad 3 smd rect (at -1 3 180) (size 1.75 6.41) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001)) - (pad 1 smd trapezoid (at -3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask) + (pad 4 smd trapezoid (at -3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001)) - (pad 1 smd rect (at -2.81 6.7 180) (size 1.375 1.3) (layers F.Cu F.Mask) + (pad 4 smd rect (at -2.81 6.699999 180) (size 1.375 1.3) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001)) - (pad 4 smd rect (at 2.8 6.7 180) (size 1.375 1.3) (layers F.Cu F.Mask) + (pad 1 smd rect (at 2.8 6.699999 180) (size 1.375 1.3) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001)) - (pad 4 smd trapezoid (at 3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask) + (pad 1 smd trapezoid (at 3.5 6.7 180) (size 1.375 1.3) (rect_delta 0 1.374 ) (layers F.Cu F.Mask) (solder_mask_margin 0.000001) (solder_paste_margin 0.000001) (clearance 0.000001) (zone_connect 2) (thermal_width 0.000001) (thermal_gap 0.000001)) )