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hardware: pcb: loosen up the ground plane / 5V some more

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Move some vias around to get the 5V plane more breathing room.  Add a
small pour to give more copper and stabilize the net.

Signed-off-by: Sean Cross <sean@xobs.io>
This commit is contained in:
Sean Cross 2018-11-02 19:22:29 +08:00
parent ced061ec5c
commit e91896a8fb
1 changed files with 18 additions and 18 deletions
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36
hardware/pcb/tomu-fpga.kicad_pcb
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@ -93,7 +93,7 @@
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "../releases/evt1/"))
(outputdirectory "../releases/evt2/"))
)
(net 0 "")
@ -3811,7 +3811,7 @@
(segment (start 83.3 66.993198) (end 86.321232 70.01443) (width 0.1524) (layer B.Cu) (net 71))
(segment (start 83.3 65.4) (end 83.3 66.993198) (width 0.1524) (layer B.Cu) (net 71))
(zone (net 4) (net_name +1V2) (layer B.Cu) (tstamp 5C05A6DE) (hatch edge 0.508)
(zone (net 4) (net_name +1V2) (layer B.Cu) (tstamp 5C05AB1F) (hatch edge 0.508)
(priority 1)
(connect_pads yes (clearance 0.154))
(min_thickness 0.254)
@ -3827,7 +3827,7 @@
)
)
)
(zone (net 1) (net_name +5V) (layer F.Cu) (tstamp 5C05A6DB) (hatch edge 0.508)
(zone (net 1) (net_name +5V) (layer F.Cu) (tstamp 5C05AB1C) (hatch edge 0.508)
(priority 3)
(connect_pads yes (clearance 0.154))
(min_thickness 0.254)
@ -3967,7 +3967,7 @@
)
)
)
(zone (net 5) (net_name +2V5) (layer F.Cu) (tstamp 5C05A6D8) (hatch edge 0.508)
(zone (net 5) (net_name +2V5) (layer F.Cu) (tstamp 5C05AB19) (hatch edge 0.508)
(priority 2)
(connect_pads yes (clearance 0.154))
(min_thickness 0.254)
@ -4030,7 +4030,7 @@
)
)
)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5C05A6D5) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer B.Cu) (tstamp 5C05AB16) (hatch edge 0.508)
(connect_pads yes (clearance 0.154))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.154) (thermal_bridge_width 0.154) (smoothing chamfer))
@ -4575,7 +4575,7 @@
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@ -4620,7 +4620,7 @@
)
)
)
(zone (net 42) (net_name /VCCPLL) (layer F.Cu) (tstamp 5C05A6D2) (hatch edge 0.508)
(zone (net 42) (net_name /VCCPLL) (layer F.Cu) (tstamp 5C05AB13) (hatch edge 0.508)
(priority 1)
(connect_pads yes (clearance 0.154))
(min_thickness 0.254)
@ -4645,7 +4645,7 @@
)
)
)
(zone (net 4) (net_name +1V2) (layer F.Cu) (tstamp 5C05A6CF) (hatch edge 0.508)
(zone (net 4) (net_name +1V2) (layer F.Cu) (tstamp 5C05AB10) (hatch edge 0.508)
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@ -4666,7 +4666,7 @@
)
)
)
(zone (net 4) (net_name +1V2) (layer F.Cu) (tstamp 5C05A6CC) (hatch edge 0.508)
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(priority 2)
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(min_thickness 0.254)
@ -4688,7 +4688,7 @@
)
)
)
(zone (net 3) (net_name +3V3) (layer F.Cu) (tstamp 5C05A6C9) (hatch edge 0.508)
(zone (net 3) (net_name +3V3) (layer F.Cu) (tstamp 5C05AB0A) (hatch edge 0.508)
(connect_pads yes (clearance 0.154))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.154) (thermal_bridge_width 0.154))
@ -5289,7 +5289,7 @@
)
)
)
(zone (net 1) (net_name +5V) (layer B.Cu) (tstamp 5C05A6C6) (hatch edge 0.508)
(zone (net 1) (net_name +5V) (layer B.Cu) (tstamp 5C05AB07) (hatch edge 0.508)
(priority 2)
(connect_pads yes (clearance 0.154))
(min_thickness 0.254)
@ -5298,7 +5298,7 @@
(pts
(xy 58.5 47.75) (xy 58.5 51) (xy 63.75 51) (xy 67 47.75) (xy 68.2 46.5)
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(zone (net 3) (net_name +3V3) (layer B.Cu) (tstamp 5C05A6C3) (hatch edge 0.508)
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@ -5330,7 +5330,7 @@
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(zone (net 1) (net_name +5V) (layer F.Cu) (tstamp 0) (hatch edge 0.508)
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