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pcb: remove paste from pads, change board version

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Change the board version to "dvt1e".

Remove solder paste from the pads.

Signed-off-by: Sean Cross <sean@xobs.io>
This commit is contained in:
Sean Cross 2018-12-24 19:21:21 +08:00
parent 8c36a8e9ad
commit ac41c361a1
1 changed files with 9 additions and 9 deletions
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18
hardware/pcb/tomu-fpga.kicad_pcb
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@ -1145,7 +1145,7 @@
(pad 2 smd rect (at 0.4 2.6) (size 1.85 4.35) (layers B.Mask))
)
(module tomu-fpga:captouch-edge (layer F.Cu) (tedit 5C015587) (tstamp 5BE194EC)
(module tomu-fpga:captouch-edge (layer F.Cu) (tedit 5C20C0CE) (tstamp 5BE194EC)
(at 28.1 21.8 180)
(path /5BE44C19)
(attr virtual)
@ -1155,14 +1155,14 @@
(fp_text value "Captouch Pads" (at 3.7 -0.3 270) (layer F.Fab)
(effects (font (size 0.1 0.1) (thickness 0.025)))
)
(pad 4 smd circle (at 0 3.5 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
(net 19 /TOUCH_4))
(pad 3 smd circle (at 0 1.3 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
(net 22 /TOUCH_3))
(pad 2 smd circle (at 0 -1.3 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
(net 21 /TOUCH_2))
(pad 1 smd circle (at 0 -3.5 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
(pad 1 smd circle (at 0 -3.5 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 20 /TOUCH_1))
(pad 2 smd circle (at 0 -1.3 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 21 /TOUCH_2))
(pad 3 smd circle (at 0 1.3 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 22 /TOUCH_3))
(pad 4 smd circle (at 0 3.5 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 19 /TOUCH_4))
)
(module tomu-fpga:C_0201_0603Metric (layer B.Cu) (tedit 5C0F2477) (tstamp 5BE17609)
@ -2235,7 +2235,7 @@
(gr_text "PCB Soldermask: Dark Blue\nPCB Thickness: 0.6mm\nHard gold plating on fingers, side\nENIG on other surfaces" (at 16.55 37.45) (layer Eco1.User)
(effects (font (size 2.5 2.5) (thickness 0.3)) (justify left))
)
(gr_text "DVT1d 12/18 SG" (at 17.55 21.875 90) (layer F.Cu)
(gr_text "DVT1e 12/18 SG" (at 17.55 21.875 90) (layer F.Cu)
(effects (font (size 0.4 0.3) (thickness 0.075)))
)
(gr_text "tomu.im FPGA" (at 26.45 26.225 90) (layer F.Cu)