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pcb: remove paste from pads, change board version

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Change the board version to "dvt1e".

Remove solder paste from the pads.

Signed-off-by: Sean Cross <sean@xobs.io>
This commit is contained in:
Sean Cross 2018-12-24 19:21:21 +08:00
parent 8c36a8e9ad
commit ac41c361a1
1 changed files with 9 additions and 9 deletions
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18
hardware/pcb/tomu-fpga.kicad_pcb
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@ -1145,7 +1145,7 @@
(pad 2 smd rect (at 0.4 2.6) (size 1.85 4.35) (layers B.Mask)) (pad 2 smd rect (at 0.4 2.6) (size 1.85 4.35) (layers B.Mask))
) )
(module tomu-fpga:captouch-edge (layer F.Cu) (tedit 5C015587) (tstamp 5BE194EC) (module tomu-fpga:captouch-edge (layer F.Cu) (tedit 5C20C0CE) (tstamp 5BE194EC)
(at 28.1 21.8 180) (at 28.1 21.8 180)
(path /5BE44C19) (path /5BE44C19)
(attr virtual) (attr virtual)
@ -1155,14 +1155,14 @@
(fp_text value "Captouch Pads" (at 3.7 -0.3 270) (layer F.Fab) (fp_text value "Captouch Pads" (at 3.7 -0.3 270) (layer F.Fab)
(effects (font (size 0.1 0.1) (thickness 0.025))) (effects (font (size 0.1 0.1) (thickness 0.025)))
) )
(pad 4 smd circle (at 0 3.5 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask) (pad 1 smd circle (at 0 -3.5 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 19 /TOUCH_4))
(pad 3 smd circle (at 0 1.3 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
(net 22 /TOUCH_3))
(pad 2 smd circle (at 0 -1.3 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
(net 21 /TOUCH_2))
(pad 1 smd circle (at 0 -3.5 180) (size 0.1 0.1) (layers F.Cu F.Paste F.Mask)
(net 20 /TOUCH_1)) (net 20 /TOUCH_1))
(pad 2 smd circle (at 0 -1.3 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 21 /TOUCH_2))
(pad 3 smd circle (at 0 1.3 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 22 /TOUCH_3))
(pad 4 smd circle (at 0 3.5 180) (size 0.1 0.1) (layers F.Cu F.Mask)
(net 19 /TOUCH_4))
) )
(module tomu-fpga:C_0201_0603Metric (layer B.Cu) (tedit 5C0F2477) (tstamp 5BE17609) (module tomu-fpga:C_0201_0603Metric (layer B.Cu) (tedit 5C0F2477) (tstamp 5BE17609)
@ -2235,7 +2235,7 @@
(gr_text "PCB Soldermask: Dark Blue\nPCB Thickness: 0.6mm\nHard gold plating on fingers, side\nENIG on other surfaces" (at 16.55 37.45) (layer Eco1.User) (gr_text "PCB Soldermask: Dark Blue\nPCB Thickness: 0.6mm\nHard gold plating on fingers, side\nENIG on other surfaces" (at 16.55 37.45) (layer Eco1.User)
(effects (font (size 2.5 2.5) (thickness 0.3)) (justify left)) (effects (font (size 2.5 2.5) (thickness 0.3)) (justify left))
) )
(gr_text "DVT1d 12/18 SG" (at 17.55 21.875 90) (layer F.Cu) (gr_text "DVT1e 12/18 SG" (at 17.55 21.875 90) (layer F.Cu)
(effects (font (size 0.4 0.3) (thickness 0.075))) (effects (font (size 0.4 0.3) (thickness 0.075)))
) )
(gr_text "tomu.im FPGA" (at 26.45 26.225 90) (layer F.Cu) (gr_text "tomu.im FPGA" (at 26.45 26.225 90) (layer F.Cu)