hardware: footprints: initial commit of WLCSP models
Signed-off-by: Sean Cross <sean@xobs.io>
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hardware/pcb/tomu-fpga.pretty/WLCSP-6.kicad_mod
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25
hardware/pcb/tomu-fpga.pretty/WLCSP-6.kicad_mod
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(module WLCSP-6 (layer F.Cu) (tedit 59E83772)
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(fp_text reference REF** (at 0 -0.9) (layer F.Fab)
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(effects (font (size 0.2 0.2) (thickness 0.05)))
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)
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(fp_text value WLCSP-6 (at 0 0.9) (layer F.Fab)
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(effects (font (size 0.2 0.2) (thickness 0.05)))
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)
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(fp_circle (center -0.6 -0.8) (end -0.6 -0.658579) (layer F.Fab) (width 0.15))
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(fp_line (start 0.45 -0.6) (end -0.45 -0.6) (layer F.Fab) (width 0.15))
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(fp_line (start 0.45 0.6) (end 0.45 -0.6) (layer F.Fab) (width 0.15))
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(fp_line (start -0.45 0.6) (end 0.45 0.6) (layer F.Fab) (width 0.15))
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(fp_line (start -0.45 -0.6) (end -0.45 0.6) (layer F.Fab) (width 0.15))
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(pad A1 smd circle (at -0.2 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.05))
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(pad A2 smd circle (at 0.2 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.05))
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(pad B1 smd circle (at -0.2 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.05))
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(pad B2 smd circle (at 0.2 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.05))
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(pad C1 smd circle (at -0.2 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.05))
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(pad C2 smd circle (at 0.2 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.05))
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)
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